HMK316B7105MLHT [TAIYO YUDEN]
Capacitor, Ceramic, Chip, General Purpose, 1uF, 100V, ±20%, X7R, 1206 (3216 mm), 0.063"T, -55º ~ +125ºC, 7" Reel/4mm pitch;
| 型号： | HMK316B7105MLHT |
| 厂家： | 
TAIYO YUDEN (U.S.A.), INC |
| 描述： | Capacitor, Ceramic, Chip, General Purpose, 1uF, 100V, ±20%, X7R, 1206 (3216 mm), 0.063"T, -55º ~ +125ºC, 7" Reel/4mm pitch 电容器 |
| 文件： | 总20页 (文件大小：721K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
[ For High Quality and/or Reliability Equipment
(Automotive / Industrial Equipment) ]
Notice for TAIYO YUDEN Products
Please read this notice before using the TAIYO YUDEN products.
REMINDERS
■ Product information in this catalog is as of October 2017. All of the contents specified herein are subject to change
without notice due to technical improvements, etc. Therefore, please check for the latest information carefully
before practical application or use of our products.
Please note that TAIYO YUDEN shall not be in any way responsible for any damages and defects in products or
equipment incorporating our products, which are caused under the conditions other than those specified in this
catalog or individual product specification sheets.
■ Please contact TAIYO YUDEN for further details of product specifications as the individual product specification
sheets are available.
■ Please conduct validation and verification of our products in actual condition of mounting and operating
environment before using our products.
■ The products listed in this catalog are intended for use in general electronic equipment (e.g., AV equipment, OA
equipment, home electric appliances, office equipment, information and communication equipment), medical
equipment classified as Class I or II by IMDRF, industrial equipment, and automotive interior applications, etc.
Please be sure to contact TAIYO YUDEN for further information before using the products for any equipment which
may directly cause loss of human life or bodily injury (e.g., transportation equipment including, without limitation,
automotive powertrain control system, train control system, and ship control system, traffic signal equipment,
medical equipment classified as Class III by IMDRF).
Please do not incorporate our products into any equipment requiring high levels of safety and/or reliability (e.g.,
aerospace equipment, aviation equipment*, medical equipment classified as Class IV by IMDRF, nuclear control
equipment, undersea equipment, military equipment).
*Note: There is a possibility that our products can be used only for aviation equipment that does not directly affect the safe operation of aircraft (e.g.,
in-flight entertainment, cabin light, electric seat, cooking equipment) if such use meets requirements specified separately by TAIYO YUDEN.
Please be sure to contact TAIYO YUDEN for further information before using our products for such aviation equipment.
When our products are used even for high safety and/or reliability-required devices or circuits of general electronic
equipment, it is strongly recommended to perform a thorough safety evaluation prior to use of our products and to
install a protection circuit as necessary.
Please note that unless you obtain prior written consent of TAIYO YUDEN, TAIYO YUDEN shall not be in any way
responsible for any damages incurred by you or third parties arising from use of the products listed in this catalog
for any equipment requiring inquiry to TAIYO YUDEN or prohibited for use by TAIYO YUDEN as described above.
■ Information contained in this catalog is intended to convey examples of typical performances and/or applications
of our products and is not intended to make any warranty with respect to the intellectual property rights or any
other related rights of TAIYO YUDEN or any third parties nor grant any license under such rights.
■ Please note that the scope of warranty for our products is limited to the delivered our products themselves and
TAIYO YUDEN shall not be in any way responsible for any damages resulting from a fault or defect in our products.
Notwithstanding the foregoing, if there is a written agreement (e.g., supply and purchase agreement, quality
assurance agreement) signed by TAIYO YUDEN and your company, TAIYO YUDEN will warrant our products in
accordance with such agreement.
■ The contents of this catalog are applicable to our products which are purchased from our sales offices or
authorized distributors (hereinafter“TAIYO YUDENs’official sales channel”). Please note that the contents of this
catalog are not applicable to our products purchased from any seller other than TAIYO YUDEN’s official sales
channel.
■ Caution for Export
Some of our products listed in this catalog may require specific procedures for export according to“U.S. Export
Administration Regulations”,“Foreign Exchange and Foreign Trade Control Law”of Japan, and other applicable
regulations. Should you have any questions on this matter, please contact our sales staff.
1
MULTILAYER CERAMIC CAPACITORS
REFLOW
AEC- Q200
■PART NUMBER
△＝Blank space
J
M
K
3
1
6
△
⑤
B
J
1
0
6
M
L
H
T
△
⑫
①
②
③
④
⑥
⑦
⑧
⑨
⑩
⑪
①Rated voltage
③End termination
Code
A
Rated voltage［VDC］
Code
End termination
4
K
J
S
F
Plated
J
6.3
10
Soft Termination
L
Cu Internal Electrodes
High Reliability Application
E
16
T
25
④Dimension（L×W）
G
35
Dimensions
U
50
Type
063
EIA（inch）
（L×W）［mm］
0.6 × 0.3
H
100
250
630
0201
0402
0204
0603
0306
0805
0508
1206
1210
1812
Q
S
1.0 × 0.5
105
0.52× 1.0
1.6 × 0.8
0.8 × 1.6
2.0 × 1.25
1.25× 2.0
3.2 × 1.6
3.2 × 2.5
4.5 × 3.2
※
②Series name
107
212
※
※
Code
M
Series name
Multilayer ceramic capacitor
V
Multilayer ceramic capacitor for high frequency
LW reverse type multilayer capacitor
316
325
432
W
Note : ※LW reverse type（□WK） only
⑤Dimension tolerance
Code
△
Type
ALL
063
L［mm］
W［mm］
T［mm］
Standard
Standard
Standard
0.6±0.05
1.0±0.10
0.3±0.05
0.3±0.05
0.5±0.10
105
0.5±0.10
107
1.6＋0.15/－0.05
0.8＋0.15/－0.05
0.8＋0.15/－0.05
0.85±0.10
A
B
212
2.0＋0.15/－0.05
1.25＋0.15/－0.05
1.25＋0.15/－0.05
1.6±0.20
316
325
105
107
3.2±0.20
1.6±0.20
3.2±0.30
2.5±0.30
2.5±0.30
1.0＋0.15/－0.05
1.6＋0.20/－0
0.5＋0.15/－0.05
0.8＋0.20/－0
0.5＋0.15/－0.05
0.8＋0.20/－0
0.85±0.10
212
2.0＋0.20/－0
1.25＋0.20/－0
1.25＋0.20/－0
1.6±0.30
316
105
107
212
212
3.2±0.30
1.6±0.30
1.0＋0.20/－0
1.6＋0.25/－0
2.0＋0.25/－0
2.0±0.15
0.5＋0.20/－0
0.8＋0.25/－0
1.25＋0.25/－0
1.25±0.15
0.5＋0.20/－0
0.8＋0.25/－0
1.25＋0.25/－0
0.85±0.15
C
K
1.15±0.20
316
325
3.2±0.20
1.6±0.20
1.6±0.20
3.2±0.50
2.5±0.30
2.5±0.30
Note: ｃｆ. STANDARD EXTERNAL DIMENSIONS
△= Blank space
⑥Temperature characteristics code
■High dielectric type
Applicable
Temperature
Ref. Temp.［℃］
range［℃］
Capacitance
tolerance
±10％
±20％
±10％
±20％
±10％
±20％
±10％
±20％
±10％
±20％
Tolerance
Code
Capacitance change
±15％
standard
code
K
BJ
C6
B7
C7
D7
EIA
EIA
EIA
EIA
EIA
X5R
X6S
X7R
X7S
X7T
－55～＋ 85
－55～＋105
－55～＋125
－55～＋125
－55～＋125
25
25
25
25
25
M
K
±22％
M
K
±15％
M
K
±22％
M
K
＋22％/－33％
M
▶ꢀThisꢀcatalogꢀcontainsꢀtheꢀtypicalꢀspecificationꢀonlyꢀdueꢀtoꢀtheꢀlimitationꢀofꢀspace.ꢀꢀWhenꢀyouꢀconsiderꢀtheꢀpurchaseꢀofꢀourꢀproducts,ꢀpleaseꢀcheckꢀourꢀproductꢀspecificationꢀsheets.ꢀ
ꢀ
Forꢀdetailsꢀofꢀeachꢀproductꢀ(characteristicsꢀgraph,ꢀreliabilityꢀinformation,ꢀprecautionsꢀforꢀuse,ꢀandꢀsoꢀon),ꢀseeꢀourꢀwebsiteꢀ(http://www.ty-top.com/)ꢀ.ꢀ
1
20
■Temperature compensating type
Applicable
Temperature
range［℃］
Capacitance
tolerance
±0.1pF
±0.25pF
±0.5pF
±1pF
Tolerance
Code
Ref. Temp.［℃］
20
Capacitance change
0±30ppm/℃
standard
code
B
JIS
EIA
CG
C
D
CG
－55～＋125
F
C0G
25
±2％
G
±5％
J
⑦Nominal capacitance
⑨Thickness
Code
Code
P
Thickness［mm］
0.3
Nominal capacitance
（example）
0R5
0.5pF
1pF
T
010
V
0.5
100
10pF
C
0.7(107type or more)
101
100pF
1,000pF
0.01μF
0.1μF
1.0μF
10μF
A
0.8
102
D
0.85(212type or more)
103
F
1.15
1.25
1.6
104
G
105
L
106
N
1.9
107
100μF
M
2.5
Note : R＝Decimal point
⑩Special code
Code
⑧Capacitance tolerance
Special code
Code
B
Capacitance tolerance
±0.1pF
H
MLCC for Industrial and Automotive
C
±0.25pF
±0.5pF
⑪Packaging
D
Code
Packaging
G
±2％
F
R
T
φ178mm Taping （2mm pitch）
J
±5％
φ178mm Embossed Taping （4mm pitch）
φ178mm Taping （4mm pitch）
K
±10％
M
±20％
φ178mm Taping （4mm pitch, 1000 pcs/reel）
325 type（Thickness code M）
P
⑫Internal code
Code
△
Internal code
Standard
▶ꢀThisꢀcatalogꢀcontainsꢀtheꢀtypicalꢀspecificationꢀonlyꢀdueꢀtoꢀtheꢀlimitationꢀofꢀspace.ꢀꢀWhenꢀyouꢀconsiderꢀtheꢀpurchaseꢀofꢀourꢀproducts,ꢀpleaseꢀcheckꢀourꢀproductꢀspecificationꢀsheets.ꢀ
ꢀ
Forꢀdetailsꢀofꢀeachꢀproductꢀ(characteristicsꢀgraph,ꢀreliabilityꢀinformation,ꢀprecautionsꢀforꢀuse,ꢀandꢀsoꢀon),ꢀseeꢀourꢀwebsiteꢀ(http://www.ty-top.com/)ꢀ.ꢀ
1
21
■STANDARD EXTERNAL DIMENSIONS
Dimension [mm] （inch）
W
Type( EIA )
L
W
T
*1
T
e
L
0.6±0.03
0.3±0.03
0.3±0.03
0.15±0.05
□MK063（0201）
(0.024±0.001)
1.0±0.05
(0.012±0.001)
0.5±0.05
(0.012±0.001)
0.5±0.05
(0.006±0.002)
0.25±0.10
T
□MK105（0402）
□MF105（0402）
V
P
A
A
C
V
D
G
D
G
D
D
Ｆ
L
(0.039±0.002)
0.52±0.05
(0.020±0.002)
1.0±0.05
(0.020±0.002)
0.3±0.05
(0.010±0.004)
0.18±0.08
e
□WK105（0204）※
(0.020±0.002)
1.6±0.10
(0.039±0.002)
0.8±0.10
(0.012±0.002)
0.8±0.10
(0.007±0.003)
0.35±0.25
□MK107（0603）
□MF107（0603）
(0.063±0.004)
1.6±0.10
(0.031±0.004)
0.8±0.10
(0.031±0.004)
0.8±0.10
(0.014±0.010)
0.35＋0.3/－0.25
(0.014＋0.012/－0.010)
0.35±0.25
L
□MJ107（0603）
□VS107（0603）
□WK107（0306）※
(0.063±0.004)
1.6±0.10
(0.031±0.004)
0.8±0.10
(0.031±0.004)
0.7±0.10
W
(0.063±0.004)
0.8±0.10
(0.031±0.004)
1.6±0.10
(0.028±0.004)
0.5±0.05
(0.014±0.010)
0.25±0.15
(0.031±0.004)
(0.063±0.004)
(0.020±0.002)
0.85±0.10
(0.010±0.006)
T
(0.033±0.004)
1.25±0.10
□MK212（0805）
□MF212（0805）
2.0±0.10
1.25±0.10
0.5±0.25
(0.079±0.004)
(0.049±0.004)
(0.020±0.010)
e
(0.049±0.004)
0.85±0.10
※ LW reverse type
(0.033±0.004)
1.25±0.10
2.0±0.10
1.25±0.10
0.5＋0.35/－0.25
□MJ212（0805）
(0.079±0.004)
(0.049±0.004)
（0.020＋0.014/－0.010）
(0.049±0.004)
0.85±0.10
2.0±0.10
(0.079±0.004)
1.25±0.15
1.25±0.10
(0.049±0.004)
2.0±0.15
0.5±0.25
(0.020±0.010)
0.3±0.2
□VS212（0805）
(0.033±0.004)
0.85±0.10
□WK212（0508）※
(0.049±0.006)
(0.079±0.006)
(0.033±0.004)
(0.012±0.008)
1.15±0.10
(0.045±0.004)
□MK316（1206）
□MF316（1206）
3.2±0.15
1.6±0.15
0.5＋0.35/－0.25
(0.126±0.006)
(0.063±0.006)
（0.020＋0.014/－0.010）
1.6±0.20
(0.063±0.008)
1.15±0.10
Ｆ
L
(0.045±0.004)
3.2±0.15
1.6±0.15
0.6＋0.4/－0.3
□MJ316（1206）
(0.126±0.006)
(0.063±0.006)
（0.024＋0.016/－0.012）
1.6±0.20
(0.063±0.008)
1.15±0.10
F
(0.045±0.004)
1.9±0.20
□MK325（1210）
□MF325（1210）
3.2±0.30
2.5±0.20
0.6±0.3
N
M
N
M
M
(0.075±0.008)
2.5±0.20
(0.126±0.012)
(0.098±0.008)
(0.024±0.012)
(0.098±0.008)
1.9±0.20
(0.075±0.008)
2.5±0.20
3.2±0.30
2.5±0.20
0.6＋0.4/－0.3
□MJ325（1210）
□MK432（1812）
(0.126±0.012)
(0.098±0.008)
（0.024＋0.016/－0.012）
(0.098±0.008)
2.5±0.20
4.5±0.40
3.2±0.30
0.9±0.6
(0.177±0.016)
(0.126±0.012)
(0.098±0.008)
(0.035±0.024)
Note : ※. LW reverse type, *1.Thickness code
▶ꢀThisꢀcatalogꢀcontainsꢀtheꢀtypicalꢀspecificationꢀonlyꢀdueꢀtoꢀtheꢀlimitationꢀofꢀspace.ꢀꢀWhenꢀyouꢀconsiderꢀtheꢀpurchaseꢀofꢀourꢀproducts,ꢀpleaseꢀcheckꢀourꢀproductꢀspecificationꢀsheets.ꢀ
ꢀ
Forꢀdetailsꢀofꢀeachꢀproductꢀ(characteristicsꢀgraph,ꢀreliabilityꢀinformation,ꢀprecautionsꢀforꢀuse,ꢀandꢀsoꢀon),ꢀseeꢀourꢀwebsiteꢀ(http://www.ty-top.com/)ꢀ.ꢀ
1
22
■STANDARD QUANTITY
Dimension
Standard quantity［pcs］
Type
063
EIA（inch）
［ｍｍ］
0.3
Code
Paper tape
Embossed tape
－
0201
T
V
P
C
A
15000
0402
0.5
105
10000
－
－
－
0204 ※
0.30
0.7
4000
0.8
3000
0603
0.8
0.8
A
A
107
（Soft Termination）
3000
－
（Soft Termination）
0306 ※
0805
0.50
0.85
1.25
V
D
G
－
4000
－
4000
－
3000
212
316
2000
1.25
G
－
（Soft Termination）
0508 ※
1206
0.85
1.15
1.6
D
F
4000
－
－
3000
2000
L
－
1.15
1.9
F
－
2000
325
432
1210
1812
N
M
M
2.5
－
－
500（T），1000（P）
500
2.5
Note : ※.LW Reverse type（□WK）
▶ꢀThisꢀcatalogꢀcontainsꢀtheꢀtypicalꢀspecificationꢀonlyꢀdueꢀtoꢀtheꢀlimitationꢀofꢀspace.ꢀꢀWhenꢀyouꢀconsiderꢀtheꢀpurchaseꢀofꢀourꢀproducts,ꢀpleaseꢀcheckꢀourꢀproductꢀspecificationꢀsheets.ꢀ
ꢀ
Forꢀdetailsꢀofꢀeachꢀproductꢀ(characteristicsꢀgraph,ꢀreliabilityꢀinformation,ꢀprecautionsꢀforꢀuse,ꢀandꢀsoꢀon),ꢀseeꢀourꢀwebsiteꢀ(http://www.ty-top.com/)ꢀ.ꢀ
1
23
■PART NUMBER
Medium-High Voltage Multilayer Ceramic Capacitors
●107TYPEꢀ (Dimension:1.6×0.8mmꢀJIS:1608ꢀEIA:0603）
【Temperature Characteristic B7 : X7R , C7 : X7S】ꢀ0.8mm thickness（A）
HTLT
Rated voltage
[V]
Temperature
characteristics
Capacitance
[F]
Capacitance
tolerance [％]
tanδ
[％]
Thickness*3 [mm]
Part number 1
Part number 2
Note
Rated voltage x ％
HMK107 B7102[]AHT
HMK107 B7152[]AHT
HMK107 B7222[]AHT
HMK107 B7332[]AHT
HMK107 B7472[]AHT
HMK107 B7682[]AHT
HMK107 B7103[]AHT
HMK107 B7153[]AHT
HMK107 B7223[]AHT
HMK107 B7333[]AHT
HMK107 B7473[]AHT
HMK107 B7104[]AHT
HMK107 C7224[]AHTE
X7R
X7R
X7R
X7R
X7R
X7R
X7R
X7R
X7R
X7R
X7R
X7R
X7S
1000 p
1500 p
2200 p
3300 p
4700 p
6800 p
0.01 μ
0.015 μ
0.022 μ
0.033 μ
0.047 μ
0.1 μ
±10, ±20
±10, ±20
±10, ±20
±10, ±20
±10, ±20
±10, ±20
±10, ±20
±10, ±20
±10, ±20
±10, ±20
±10, ±20
±10, ±20
±10, ±20
3.5
3.5
3.5
3.5
3.5
3.5
3.5
3.5
3.5
3.5
3.5
3.5
3.5
200
200
200
200
200
200
200
200
200
200
200
200
150
0.8±0.10
0.8±0.10
0.8±0.10
0.8±0.10
0.8±0.10
0.8±0.10
0.8±0.10
0.8±0.10
0.8±0.10
0.8±0.10
0.8±0.10
0.8±0.10
0.8±0.10
*1, *2
*1, *2
*1, *2
*1, *2
*1, *2
*1, *2
*1, *2
*1, *2
*1, *2
*1, *2
*1, *2
*1, *2
*1, *2
100
0.22 μ
●212TYPEꢀ(Dimension:2.0×1.25mmꢀJIS:2012ꢀEIA:0805）
【Temperature Characteristic B7 : X7R , C7 : X7S】ꢀ1.25mm thickness（G）
HTLT
Rated voltage
[V]
Temperature
characteristics
Capacitance
[F]
Capacitance
tolerance [％]
tanδ
[％]
Thickness*3 [mm]
Part number 1
Part number 2
Note
Rated voltage x ％
HMK212 B7103[]GHT
HMK212 B7153[]GHT
HMK212 B7223[]GHT
HMK212 B7333[]GHT
HMK212 B7473[]GHT
HMK212 B7683[]GHT
HMK212 B7104[]GHT
HMK212 B7224[]GHT
HMK212 C7474[]GHTE
HMK212BC7105[]GHTE
QMK212 B7472[]GHT
QMK212 B7682[]GHT
QMK212 B7103[]GHT
QMK212 B7153[]GHT
QMK212 B7223[]GHT
X7R
X7R
X7R
X7R
X7R
X7R
X7R
X7R
X7S
X7S
X7R
X7R
X7R
X7R
X7R
0.01 μ
0.015 μ
0.022 μ
0.033 μ
0.047 μ
0.068 μ
0.1 μ
±10, ±20
±10, ±20
±10, ±20
±10, ±20
±10, ±20
±10, ±20
±10, ±20
±10, ±20
±10, ±20
±10, ±20
±10, ±20
±10, ±20
±10, ±20
±10, ±20
±10, ±20
3.5
3.5
3.5
3.5
3.5
3.5
3.5
3.5
3.5
3.5
2.5
2.5
2.5
2.5
2.5
200
200
200
200
200
200
200
200
150
150
150
150
150
150
150
1.25±0.10
1.25±0.10
1.25±0.10
1.25±0.10
1.25±0.10
1.25±0.10
1.25±0.10
1.25±0.10
1.25±0.10
1.25+0.20/-0
1.25±0.10
1.25±0.10
1.25±0.10
1.25±0.10
1.25±0.10
*1, *2
*1, *2
*1, *2
*1, *2
*1, *2
*1, *2
*1, *2
*1, *2
*1, *2
*1, *2
*1, *2
*1, *2
*1, *2
*1, *2
*1, *2
100
0.22 μ
0.47 μ
1 μ
4700 p
6800 p
250
0.01 μ
0.015 μ
0.022 μ
【Temperature Characteristic B7 : X7R】ꢀ0.85mm thickness（D）
HTLT
Rated voltage
[V]
Temperature
characteristics
Capacitance
[F]
Capacitance
tolerance [％]
tanδ
[％]
Thickness*3 [mm]
Part number 1
Part number 2
Note
Rated voltage x ％
QMK212 B7102[]DHT
QMK212 B7152[]DHT
QMK212 B7222[]DHT
QMK212 B7332[]DHT
X7R
X7R
X7R
X7R
1000 p
1500 p
2200 p
3300 p
±10, ±20
±10, ±20
±10, ±20
±10, ±20
2.5
2.5
2.5
2.5
150
150
150
150
0.85±0.10
0.85±0.10
0.85±0.10
0.85±0.10
*1, *2
*1, *2
*1, *2
*1, *2
250
●316TYPE (Dimension:3.2×1.6mmꢀJIS:3216ꢀEIA:1206）
【Temperature Characteristic B7 : X7R , C7 : X7S】ꢀ1.6mm thickness（L）
HTLT
Rated voltage
[V]
Temperature
characteristics
Capacitance
[F]
Capacitance
tolerance [％]
tanδ
[％]
Thickness*3 [mm]
Part number 1
Part number 2
Note
Rated voltage x ％
HMK316 B7473[]LHT
HMK316 B7104[]LHT
HMK316 B7154[]LHT
HMK316 B7224[]LHT
HMK316 B7334[]LHT
HMK316 B7474[]LHT
HMK316 B7105[]LHT
HMK316AC7225[]LHTE
QMK316 B7333[]LHT
QMK316 B7473[]LHT
QMK316 B7683[]LHT
QMK316 B7104[]LHT
SMK316 B7153[]LHT
SMK316 B7223[]LHT
X7R
X7R
X7R
X7R
X7R
X7R
X7R
X7S
X7R
X7R
X7R
X7R
X7R
X7R
0.047 μ
0.1 μ
±10, ±20
±10, ±20
±10, ±20
±10, ±20
±10, ±20
±10, ±20
±10, ±20
±10, ±20
±10, ±20
±10, ±20
±10, ±20
±10, ±20
±10, ±20
±10, ±20
3.5
3.5
3.5
3.5
3.5
3.5
3.5
3.5
2.5
2.5
2.5
2.5
2.5
2.5
200
200
200
200
200
200
200
150
150
150
150
150
120
120
1.6±0.20
1.6±0.20
1.6±0.20
1.6±0.20
1.6±0.20
1.6±0.20
1.6±0.20
1.6±0.20
1.6±0.20
1.6±0.20
1.6±0.20
1.6±0.20
1.6±0.20
1.6±0.20
*1, *2
*1, *2
*1, *2
*1, *2
*1, *2
*1, *2
*1, *2
*1, *2
*1, *2
*1, *2
*1, *2
*1, *2
*1, *2
*1, *2
0.15 μ
0.22 μ
0.33 μ
0.47 μ
1 μ
100
2.2 μ
0.033 μ
0.047 μ
0.068 μ
0.1 μ
250
630
0.015 μ
0.022 μ
【Temperature Characteristic B7 : X7R】ꢀ1.15mm thickness（F）
HTLT
Rated voltage
[V]
Temperature
characteristics
Capacitance
[F]
Capacitance
tolerance [％]
tanδ
[％]
Thickness*3 [mm]
Part number 1
Part number 2
Note
Rated voltage x ％
SMK316 B7102[]FHT
SMK316 B7152[]FHT
SMK316 B7222[]FHT
SMK316 B7332[]FHT
SMK316 B7472[]FHT
SMK316 B7682[]FHT
SMK316 B7103[]FHT
X7R
X7R
X7R
X7R
X7R
X7R
X7R
1000 p
1500 p
2200 p
3300 p
4700 p
6800 p
0.01 μ
±10, ±20
±10, ±20
±10, ±20
±10, ±20
±10, ±20
±10, ±20
±10, ±20
2.5
2.5
2.5
2.5
2.5
2.5
2.5
120
120
120
120
120
120
120
1.15±0.10
1.15±0.10
1.15±0.10
1.15±0.10
1.15±0.10
1.15±0.10
1.15±0.10
*1, *2
*1, *2
*1, *2
*1, *2
*1, *2
*1, *2
*1, *2
630
▶ꢀThisꢀcatalogꢀcontainsꢀtheꢀtypicalꢀspecificationꢀonlyꢀdueꢀtoꢀtheꢀlimitationꢀofꢀspace.ꢀꢀWhenꢀyouꢀconsiderꢀtheꢀpurchaseꢀofꢀourꢀproducts,ꢀpleaseꢀcheckꢀourꢀproductꢀspecificationꢀsheets.ꢀ
ꢀ
Forꢀdetailsꢀofꢀeachꢀproductꢀ(characteristicsꢀgraph,ꢀreliabilityꢀinformation,ꢀprecautionsꢀforꢀuse,ꢀandꢀsoꢀon),ꢀseeꢀourꢀwebsiteꢀ(http://www.ty-top.com/)ꢀ.ꢀ
1
29
■PART NUMBER
●325TYPE (Dimension:3.2×2.5mmꢀJIS:3225ꢀEIA:1210）
【Temperature Characteristic B7 : X7R , C7 : X7S】ꢀ2.5mm thickness（M）
HTLT
Rated voltage
[V]
Temperature
characteristics
Capacitance
[F]
Capacitance
tolerance [％]
tanδ
[％]
Thickness*3 [mm]
Part number 1
Part number 2
Note
Rated voltage x ％
HMK325 B7225[]MHP
HMK325 C7475[]MHPE
X7R
X7S
2.2 μ
4.7 μ
±10, ±20
±10, ±20
3.5
3.5
200
150
2.5±0.20
2.5±0.20
*1, *2
*1, *2
100
【Temperature Characteristic B7 : X7R】ꢀ1.9mm thickness（N）
HTLT
Rated voltage
[V]
Temperature
characteristics
Capacitance
[F]
Capacitance
tolerance [％]
tanδ
[％]
Thickness*3 [mm]
Part number 1
Part number 2
Note
Rated voltage x ％
HMK325 B7224[]NHT
HMK325 B7474[]NHT
HMK325 B7684[]NHT
HMK325 B7105[]NHT
QMK325 B7473[]NHT
QMK325 B7104[]NHT
QMK325 B7154[]NHT
QMK325 B7224[]NHT
SMK325 B7223[]NHT
SMK325 B7333[]NHT
SMK325 B7473[]NHT
X7R
X7R
X7R
X7R
X7R
X7R
X7R
X7R
X7R
X7R
X7R
0.22 μ
0.47 μ
0.68 μ
1 μ
±10, ±20
±10, ±20
±10, ±20
±10, ±20
±10, ±20
±10, ±20
±10, ±20
±10, ±20
±10, ±20
±10, ±20
±10, ±20
3.5
3.5
3.5
3.5
2.5
2.5
2.5
2.5
2.5
2.5
2.5
200
200
200
200
150
150
150
150
120
120
120
1.9±0.20
1.9±0.20
1.9±0.20
1.9±0.20
1.9±0.20
1.9±0.20
1.9±0.20
1.9±0.20
1.9±0.20
1.9±0.20
1.9±0.20
*1, *2
*1, *2
*1, *2
*1, *2
*1, *2
*1, *2
*1, *2
*1, *2
*1, *2
*1, *2
*1, *2
100
0.047 μ
0.1 μ
250
630
0.15 μ
0.22 μ
0.022 μ
0.033 μ
0.047 μ
【Temperature Characteristic B7 : X7R】ꢀ1.15mm thickness（F）
HTLT
Rated voltage x ％
200
Rated voltage
[V]
Temperature
characteristics
Capacitance
[F]
Capacitance
tolerance [％]
tanδ
[％]
Thickness*3 [mm]
1.15±0.10
Part number 1
Part number 2
Note
HMK325 B7104[]FHT
100
X7R
0.1 μ
±10, ±20
3.5
*1, *2
●432TYPE (Dimension:4.5×3.2mmꢀJIS:4532ꢀEIA:1812）
【Temperature Characteristic B7 : X7R】 2.5mm thickness（M）
HTLT
Rated voltage
[V]
Temperature
characteristics
Capacitance
[F]
Capacitance
tolerance [％]
tanδ
[％]
Thickness*3 [mm]
Part number 1
Part number 2
Note
Rated voltage x ％
HMK432 B7474[]MHT
HMK432 B7105[]MHT
HMK432 B7155[]MHT
HMK432 B7225[]MHT
QMK432 B7104[]MHT
QMK432 B7224[]MHT
QMK432 B7334[]MHT
QMK432 B7474[]MHT
SMK432 B7473[]MHT
SMK432 B7683[]MHT
SMK432 B7104[]MHT
X7R
X7R
X7R
X7R
X7R
X7R
X7R
X7R
X7R
X7R
X7R
0.47 μ
1 μ
±10, ±20
±10, ±20
±10, ±20
±10, ±20
±10, ±20
±10, ±20
±10, ±20
±10, ±20
±10, ±20
±10, ±20
±10, ±20
3.5
3.5
3.5
3.5
2.5
2.5
2.5
2.5
2.5
2.5
2.5
200
200
200
200
150
150
150
150
120
120
120
2.5±0.20
2.5±0.20
2.5±0.20
2.5±0.20
2.5±0.20
2.5±0.20
2.5±0.20
2.5±0.20
2.5±0.20
2.5±0.20
2.5±0.20
*1, *2
*1, *2
*1, *2
*1, *2
*1, *2
*1, *2
*1, *2
*1, *2
*1, *2
*1, *2
*1, *2
100
1.5 μ
2.2 μ
0.1 μ
0.22 μ
0.33 μ
0.47 μ
0.047 μ
0.068 μ
0.1 μ
250
630
▶ꢀThisꢀcatalogꢀcontainsꢀtheꢀtypicalꢀspecificationꢀonlyꢀdueꢀtoꢀtheꢀlimitationꢀofꢀspace.ꢀꢀWhenꢀyouꢀconsiderꢀtheꢀpurchaseꢀofꢀourꢀproducts,ꢀpleaseꢀcheckꢀourꢀproductꢀspecificationꢀsheets.ꢀ
ꢀ
Forꢀdetailsꢀofꢀeachꢀproductꢀ(characteristicsꢀgraph,ꢀreliabilityꢀinformation,ꢀprecautionsꢀforꢀuse,ꢀandꢀsoꢀon),ꢀseeꢀourꢀwebsiteꢀ(http://www.ty-top.com/)ꢀ.ꢀ
1
30
Multilayer Ceramic Capacitors
■PACKAGING
①Minimum Quantity
●Taped package
Thickness
Standard quantity [pcs]
Type(EIA)
mm
code
K
Paper tape
Embossed tape
□MK021(008004)
□VS021(008004)
□MK042(01005)
□VS042(01005)
□MK063(0201)
0.125
－
－
50000
0.2
0.2
C, D
C
P,T
P
40000
0.3
15000
10000
－
－
－
□WK105(0204) ※
0.3
0.13
0.18
0.2
H
E
20000
15000
－
－
□MK105(0402)
□MF105(0402)
C
P
20000
15000
10000
10000
4000
－
0.3
－
0.5
V
W
K
－
□VK105(0402)
□MK107(0603)
□WK107(0306) ※
□MF107(0603)
□VS107(0603)
□MJ107(0603)
0.5
－
0.45
0.5
－
V
A
C
A
K
4000
－
0.8
4000
4000
3000
0.7
－
0.8
3000
0.45
0.85
1.25
0.85
0.85
1.25
0.85
1.15
1.6
□MK212(0805)
4000
－
□WK212(0508)
□MF212(0805)
※
D
G
D
D
G
D
F
－
4000
4000
－
3000
－
□VS212(0805)
□MJ212(0805)
－
2000
－
4000
－
□MK316(1206)
□MF316(1206)
3000
2000
3000
2000
L
－
1.15
1.6
F
－
□MJ316(1206)
L
－
0.85
1.15
1.9
D
F
－
2000
□MK325(1210)
□MF325(1210)
N
Y
2.0max.
2.5
M
N
M
M
－
－
－
－
1000
2000
1.9
□MJ325(1210)
□MK432(1812)
2.5
500(T), 1000(P)
500
2.5
Note : ※ LW Reverse type.
②Taping material
※No bottom tape for pressed carrier tape
●Card board carrier tape
●Embossed tape
Top tape
Top tape
Base tape
Sprocket hole
Chip cavity
Sprocket hole
Chip cavity
Bottom tape
Base tape
▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .
c_mlcc_pack_e-E06R01
Chip filled
Chip
※ LW Reverse type.
③Representative taping dimensions
●Paper Tape（8mm wide）
●Pressed carrier tape（ 2mm pitch）
Unit：mm（inch）
T
1.75±0.1
φ1.5＋0.1/－0
(0.069±0.004）
(φ0.059＋0.004/-0)
Sprocket hole
A
B
T1
2.0±0.05
4.0±0.1
F
(0.079±0.002) (0.157±0.004)
Chip Cavity
Insertion Pitch
Tape Thickness
Type(EIA)
Ａ
Ｂ
Ｆ
Ｔ
T1
□MK063(0201)
0.37
0.67
0.45max.
0.42max.
□WK105(0204) ※
□MK105(0402) （*1 C）
□MK105(0402) （*1 P）
2.0±0.05
0.65
1.15
0.4max.
0.3max.
0.42max.
Unit：mm
0.45max.
Note *1 Thickness, C：0.2mm ,P：0.3mm. ※ LW Reverse type.
●Punched carrier tape （2mm pitch）
Unit：mm（inch）
1.75±0.1
φ1.5＋0.1/－0
(0.069±0.004）
(φ0.059＋0.004/-0)
Sprocket hole
T
A
B
F
2.0±0.05
4.0±0.1
(0.079±0.002) (0.157±0.004)
Chip Cavity
Insertion Pitch
Ｆ
Tape Thickness
Ｔ
Type(EIA)
Ａ
Ｂ
□MK105 (0402)
□MF105 (0402)
□VK105 (0402)
0.65
1.15
2.0±0.05
0.8max.
Unit：mm
●Punched carrier tape （4mm pitch）
φ1.5＋0.1/－0
Unit：mm（inch）
T
1.75±0.1
(0.069±0.004）
(φ0.059＋0.004/-0)
Sprocket hole
A
B
4.0±0.1
(0.157±0.004)
2.0±0.1
F
(0.079±0.004)
▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .
c_mlcc_pack_e-E06R01
Chip Cavity
Insertion Pitch
Ｆ
Tape Thickness
Ｔ
Type(EIA)
Ａ
Ｂ
□MK107(0603)
□WK107(0306)
□MF107(0603)
□MK212(0805)
□WK212(0508)
□MK316(1206)
※
※
1.0
1.8
1.1max.
4.0±0.1
1.65
2.0
2.4
3.6
1.1max.
Note：Taping size might be different depending on the size of the product. ※ LW Reverse type.
Unit：mm
●Embossed tape（4mm wide）
Sprocket hole
Unit：mm（inch）
0.9±0.05
φ0.8±0.04
(0.035±0.002)
(φ0.031±0.002)
A
B
F
1.0±0.02
2.0±0.04
(0.039±0.001) (0.079±0.002)
Chip Cavity
Insertion Pitch
Tape Thickness
Type(EIA)
Ａ
Ｂ
Ｆ
K
T
□MK021(008004)
□VS021(008004)
□MK042(01005)
□VS042(01005)
0.135
0.27
1.0±0.02
0.5max.
0.25max.
Unit：mm
0.23
0.43
●Embossed tape（8mm wide）
Unit：mm（inch）
1.75±0.1
φ1.5＋0.1/－0
(0.069±0.004）
(φ0.059＋0.004/-0)
Sprocket hole
A
B
F
4.0±0.1
(0.157±0.004)
2.0±0.1
(0.079±0.004)
Chip Cavity
Insertion Pitch
Tape Thickness
Type(EIA)
Ａ
Ｂ
Ｆ
K
T
□MK105(0402)
0.6
1.0
1.1
1.8
2.0±0.1
0.6max
1.3max.
0.2±0.1
0.25±0.1
□WK107(0306) ※
□MK212(0805)
1.65
2.0
2.4
3.6
3.6
□MF212(0805)
4.0±0.1
□MK316(1206)
□MF316(1206)
3.4max.
0.6max.
□MK325(1210)
2.8
□MF325(1210)
Note： ※ LW Reverse type.
Unit：mm
▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .
c_mlcc_pack_e-E06R01
●Embossed tape（12mm wide）
φ1.5＋0.1/－0
(φ0.059＋0.004/-0)
Unit：mm（inch）
1.75±0.1
(0.069±0.004）
Sprocket hole
A
B
4.0±0.1
2.0±0.1
(0.157±0.004)
F
(0.079±0.004)
Chip Cavity
Insertion Pitch
Ｆ
Tape Thickness
Type(EIA)
Ａ
Ｂ
K
T
□MK325(1210)
□MK432(1812)
3.1
3.7
4.0
4.9
8.0±0.1
8.0±0.1
4.0max.
4.0max.
0.6max.
0.6max.
Unit：mm
④Trailer and Leader
Blank portion
Chip cavity
Blank portion
Leader
100mm or more
160mm or more
(3.94inches or more)
(6.3inches or more)
400mm or more
(15.7inches or more)
Direction of tape feed
⑤Reel size
t
E
C
B
A
R
D
W
A
B
C
φ13.0±0.2
D
E
R
φ178±2.0
φ50min.
φ21.0±0.8
2.0±0.5
1.0
T
W
4mm wide tape
8mm wide tape
12mm wide tape
1.5max.
2.5max.
2.5max.
5±1.0
10±1.5
14±1.5
Unit：mm
⑥Top Tape Strength
The top tape requires a peel-off force of 0.1 to 0.7N in the direction of the arrow as illustrated below.
Pull direction
0～20°
Top tape
Base tape
▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .
c_mlcc_pack_e-E06R01
Medium-High Voltage Multilayer Ceramic Capacitor
■RELIABILITY DATA
1. Operating Temperature Range
Temperature Compensating(High Frequency type)
CG(C0G)
: －55 to ＋125℃
Specified Value
High permittivity
X7R, X7S : －55 to ＋125℃
X5
B
: －55 to ＋85℃
: －25 to ＋85℃
2. Storage Temperature Range
Temperature Compensating(High Frequency type)
CG(C0G) : －55 to ＋125℃
Specified Value
High permittivity
X7R, X7S : －55 to ＋125℃
X5R
B
: －55 to ＋85℃
: －25 to ＋85℃
3. Rated Voltage
Specified Value
100VDC(HMK,HMJ), 250VDC(QMK,QMJ,QVS), 630VDC(SMK,SMJ)
4. Withstanding Voltage（Between terminals）
Specified Value
No breakdown or damage
Applied voltage
Duration
: Rated voltage×2.5（HMK,HMJ）, Rated voltage×2（QMK,QMJ,QVS）, Rated voltage×1.2（SMK,SMJ）
Test Methods and
Remarks
: 1 to 5sec.
: 50mA max.
Carge/discharge current
５．Insulation Resistance
Temperature Compensating(High Frequency type)
10000MΩ min
Specified Value
High permittivity
100MΩμF or 10GΩ, whichever is smaller.
Applied voltage
Duration
: Rated voltage（HMK,HMJ, QMK,QMJ,QVS）, 500V（SMK,SMJ）
Test Methods and
Remarks
: 60±5sec.
: 50mA max.
Charge/discharge current
6．Capacitance （Tolerance）
Temperature Compensating(High Frequency type)
±0.1pF (C＜5pF) ±0.25pF (C＜10pF) ±0.5pF (5pF≦C＜10pF) ±2%(C=10pF) ±5%(C≧10pF)
Specified Value
High permittivity
±10%, ±20%
Temperature Compensating(High Frequency type)
Measuring frequency
Measuring voltage
Bias application
: 1MHz±10%
: 0.5 to 5Vrms
: None
Test Methods and
Remarks
High permittivity
Measuring frequency
Measuring voltage
Bias application
: 1kHz±10%
: 1±0.2Vrms
: None
▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .
hq_c_mlcc_mhv_reli_e-E06R01
7．Q or Dissipation Factor
Temperature Compensating(High Frequency type)
C＜30pF : Q≧800＋20C
C≧30pF : Q≧1400
C:Normal Capacitance(/pF)
Specified Value
High permittivity
3.5%max（HMK,HMJ）
2.5%max（QMK,QMJ, SMK,SMJ）
Temperature Compensating(High Frequency type)
Measuring frequency
Measuring voltage
Bas application
: 1MHz±10%
: 0.5 to 5Vrms
: None
Test Methods and
Remarks
High permittivity
Measuring frequency
Measuring voltage
Bas application
: 1kHz±10%
: 1±0.2Vrms
: None
8．Temperature Characteristic of Capacitance
Temperature Compensating(High Frequency type)
C0G :±30ppm（25 to ＋125℃）
High permittivity
Specified Value
B
: ±10%（－25 to ＋85℃）
X5R
X7R
X7S
: ±15%（－55 to ＋85℃）
: ±15%（－55 to ＋125℃）
: ±22%（－55 to ＋125℃）
Temperature Compensating(High Frequency type)
Capacitance at 25℃ and 85℃ shall be measured in thermal equilibrium, and the temperature characteristic shall be calculated from the
ｆollowing equation.
（C85－C25）
×106×[ppm/℃]
C25×ΔT
High permittivity
Capacitance value at each step shall be measured in thermal equilibrium, and the temperature characteristic shall be calculated from the
following equation.
Test Methods and
Remarks
Step
B
X5R、X7R、X7S
Minimum operating tempeature
20℃ 25℃
1
2
3
Maximum operating temperature
（C－C2）
C2
×100（%）
C
: Capacitance value in Step 1 or Step 3
C2 : Capacitance value in Step 2
9．Deflection
Temperature Compensating(High Frequency type)
Appearance
Capacitance change
: No abnormality
:±5% or ±0.5pF, whichever is larger.
Specified Value
High permittivity
Appearance
: No abnormality
: Within±10%
Capacitance change
Warp
: 1mm （Soft Termination type:3mm）
: 10sec.
Duration
Test board
Thicknss
: Glass epoxy-resin substrate
: 1.6mm
Test Methods and
Remarks
Capacitance measurement shall be conducted with the board bent.
▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .
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10．Adhesive Strength of Terminal Electrodes
Specified Value
No terminal separation or its indication.
Temperature Compensating(High Frequency type)
Applied force
Duration
: 2N
: 10±5sec.
Test Methods and
Remarks
High permittivity
Applied force
Duration
: 5N
: 30±5sec.
11．Solderability
Specified Value
At least 95% of terminal electrode is covered by new solder
Eutectic solder
Lead-free solder
Sn-3.0Ag-0.5Cu
245±3℃
Solder type
H60A or H63A
230±5℃
Test Methods and
Remarks
Solder temperature
Duration
4±1 sec.
12．Resistance to Soldering
Temperature Compensating(High Frequency type)
Appearance : No abnormality
Capacitance change
Insulation resistance
Withstanding voltage
: C※≦10pF :±0.25pF C※＞10pF :±2.5% ※Normal capacitance
: Initial value
（between terminals） : No abnormality
Specified Value
High permittivity
Appearance
: No abnormality
Capacitance change
Dissipation factor
Insulation resistance
Withstanding voltage
: Within±15%（HMK,HMJ）, ±10%（QMK,QMJ, SMK,SMJ）
: Inital value
: Initial value
（between terminals） : No abnormality
Preconditioning
Solder temperature
Duration
: Thermal treatment（at 150℃ for 1hr） Note1 (Only High permittivity)
: 270±5℃
: 3±0.5sec.
Test Methods and
Remarks
Preheating conditions
Recovery
: 80 to 100℃, 2 to 5 min.
150 to 200℃, 2 to 5min.
: 24±2hrs under the stadard condition Note3
13．Temperature Cycle （Thermal Shock）
Temperature Compensating(High Frequency type)
Appearance
: No abnormality
Capacitance change
Insulation resistance
Withstanding voltage
: C※≦10pF :±0.25% C※＞10pF :±2.5%
: Initial value
（between terminals） : No abnormality
Specified Value
High permittivity
Appearance
: No abnormality
Capacitance change
Dissipation factor
Insulation resistance
Withstanding voltage
: Within±15%（HMK,HMJ）, ±7.5%（QMK,QMJ, SMK,SMJ）
: Initial value
: Initial value
（between terminals） : No abnormality
Preconditioning : Thermal treatment （at 150℃ for 1hr） Note1
Conditions for 1 cycle
Step
temperature（℃）
Minimum operating temperature
Normal temperature
Time（min.）
1
2
3
4
30±3min.
2 to 3min.
30±3min.
2 to 3min.
Test Methods and
Remarks
Maximum operating temperature
Normal temperature
Number of cycles : 5 times
Recovery : 24±2hrs under the standard condition Note3
▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .
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14．Humidity （Steady state）
Temperature Compensating(High Frequency type)
Appearance
: No abnormality
Capacitance change
Insulation resistance
: C※≦10pF :±0.5pF C※＞10pF :±5% ※Normal capacitance
: 1000MΩmin
Specified Value
High permittivity
Appearance
: No abnormality
: Within±15%
Capacitance change
Dissipation factor
Insulation resistance
: 7%max（HMK,HMJ）, 5%max（QMK,QMJ, SMK,SMJ）.
: 25MΩμF or 1000MΩ, whichever is smaller.
Preconditioning
Temperature
Humidity
: Thermal treatment（at 150℃ for 1hr） Note1 (Only High permittivity)
: 40±2℃
Test Methods and
Remarks
: 90 to 95%RH
Duration
: 500 ＋24/－0 hrs
Recovery
: 24±2hrs under the standard condition Note3
15．Humidity Loading
Temperature Compensating(High Frequency type)
Appearance
: No abnormality
Capacitance change
: C※≦2.0pF :±0.4pF 2.0pF＜C≦10pF : ±0.75pF C※＞10pF :±7.5%
: ※Normal capacitance
: 500MΩmin
Insulation resistance
Specified Value
High permittivity
Appearance
: No abnormality
Capacitance change
Dissipation factor
Insulation resistance
: Within±15%
: 7%max（HMK,HMJ）, 5%max（QMK,QMJ, SMK,SMJ）.
: 10MΩμF or 500MΩ, whichever is smaller.
According to JIS 5102 clause 9.9.
Preconditioning
Temperature
: Voltage treatment Note2 (Only High permittivity)
: 40±2℃
Test Methods and Humidity
Remarks Applied voltage
: 90 to 95%RH
: Rated voltage
Charge/discharge current
Duration
: 50mA max.
: 500 ＋24/－0 hrs
: 24±2hrs under the standard condition Note3
Recovery
16．High Temperature Loading
Appearance
Temperature Compensating(High Frequency type)
: No abnormality
Capacitance change
: C※≦10pF :±0.3pF C※＞10pF :±3%
:1000MΩmin
Insulation resistance
Specified Value
High permittivity
Appearance
: No abnormality
Capacitance change
Dissipation factor
Insulation resistance
: Within±15%
: 7%max（HMK,HMJ）, 5%max（QMK,QMJ, SMK,SMJ）.
: 50MΩμF or 1000MΩ, whichever is smaller.
According to JIS 5102 clause 9.10.
Preconditioning
Temperature
: Voltage treatment Note2 (Only High permittivity)
: Maximum operating temperature
Test Methods and
Remarks
Applied voltage
Charge/discharge current
Duration
: Rated voltage×2（HMK,HMJ,QVS） Rated voltage×1.5（QMK,QMJ） Rated voltage×1.2（SMK,SMJ）
: 50mA max.
: 1000 ＋24/－0 hrs
Recovery
: 24±2hrs under the standard condition Note3
Note1 Thermal treatment : Initial value shall be measured after test sample is heat-treated at 150＋0/－10℃ for an hour and kept at room temperature
for 24±2hours.
Note2 Voltage treatment : Initial value shall be measured after test sample is voltage-treated for an hour at both the temperature and voltage specified in
the test conditions, and kept at room temperature for 24±2hours.
Note3 Standard condition : Temperature: 5 to 35℃, Relative humidity: 45 to 85 % RH, Air pressure: 86 to 106kPa
When there are questions concerning measurement results, in order to provide correlation data, the test shall be conducted
under the following condition.
Temperature: 20±2℃, Relative humidity: 60 to 70 % RH, Air pressure: 86 to 106kPa
Unless otherwise specified, all the tests are conducted under the "standard condition".
▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .
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Precautions on the use of Multilayer Ceramic Capacitors
■PRECAUTIONS
1. Circuit Design
◆Verification of operating environment, electrical rating and performance
1. A malfunction of equipment in fields such as medical, aerospace, nuclear control, etc. may cause serious harm to human life or have
severe social ramifications.
Therefore, any capacitors to be used in such equipment may require higher safety and reliability, and shall be clearly differentiated from
them used in general purpose applications.
Precautions
◆Operating Voltage （Verification of Rated voltage）
1. The operating voltage for capacitors must always be their rated voltage or less.
If an AC voltage is loaded on a DC voltage, the sum of the two peak voltages shall be the rated voltage or less.
For a circuit where an AC or a pulse voltage may be used, the sum of their peak voltages shall also be the rated voltage or less.
2. Even if an applied voltage is the rated voltage or less reliability of capacitors may be deteriorated in case that either a high frequency AC
voltage or a pulse voltage having rapid rise time is used in a circuit.
2. PCB Design
◆Pattern configurations （Design of Land-patterns）
1. When capacitors are mounted on PCBs, the amount of solder used （size of fillet） can directly affect the capacitor performance.
Therefore, the following items must be carefully considered in the design of land patterns:
（1）Excessive solder applied can cause mechanical stresses which lead to chip breaking or cracking. Therefore, please consider
appropriate land-patterns for proper amount of solder.
Precautions
（2）When more than one component are jointly soldered onto the same land, each component's soldering point shall be separated by
solder-resist.
◆Pattern configurations （Capacitor layout on PCBs）
After capacitors are mounted on boards, they can be subjected to mechanical stresses in subsequent manufacturing processes （PCB
cutting, board inspection, mounting of additional parts, assembly into the chassis, wave soldering of the boards, etc.）. For this reason, land
pattern configurations and positions of capacitors shall be carefully considered to minimize stresses.
◆Pattern configurations （Design of Land-patterns）
The following diagrams and tables show some examples of recommended land patterns to prevent excessive solder amounts.
（1）Recommended land dimensions for typical chip capacitors
●Multilayer Ceramic Capacitors : Recommended land dimensions
Land patterns for PCBs
（unit: mm）
Wave-soldering
Type
107
1.6
212
2.0
316
3.2
325
3.2
L
Size
W
0.8
1.25
1.6
2.5
A
B
C
0.8 to 1.0
0.5 to 0.8
0.6 to 0.8
1.0 to 1.4
0.8 to 1.5
0.9 to 1.2
1.8 to 2.5
0.8 to 1.7
1.2 to 1.6
1.8 to 2.5
0.8 to 1.7
1.8 to 2.5
Reflow-soldering
Type 042
063
0.6
105
1.0
107
1.6
0.8
212
2.0
316
3.2
325
3.2
432
L
0.4
4.5
Size
Technical
W
0.2
0.3
0.5
1.25
1.6
2.5
3.2
considerations
A
B
C
0.15 to 0.25
0.15 to 0.20
0.15 to 0.30
0.20 to 0.30
0.20 to 0.30
0.25 to 0.40
0.45 to 0.55
0.40 to 0.50
0.45 to 0.55
0.8 to 1.0
0.8 to 1.2
0.8 to 1.2
0.9 to 1.6
1.8 to 2.5
1.0 to 1.5
1.2 to 2.0
1.8 to 2.5
1.0 to 1.5
1.8 to 3.2
2.5 to 3.5
1.5 to 1.8
2.3 to 3.5
0.6 to 0.8
0.6 to 0.8
Note：Recommended land size might be different according to the allowance of the size of the product.
●LWDC: Recommended land dimensions for reflow-soldering
（unit: mm）
Type
105
0.52
107
0.8
212
1.25
L
Size
W
1.0
1.6
2.0
A
B
C
0.18 to 0.22
0.2 to 0.25
0.9 to 1.1
0.25 to 0.3
0.3 to 0.4
1.5 to 1.7
0.5 to 0.7
0.4 to 0.5
1.9 to 2.1
▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .
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（2）Examples of good and bad solder application
Items
Not eommended
Recommended
Mixed mounting of SMD and
leaded components
Component placement close to
the chassis
Hand-soldering of leaded
Components near mounted
components
Horizontal component
placement
◆Pattern configurations （Capacitor layout on PCBs）
1-1. The following is examples of good and bad capacitor layouts ; capacitors shall be located to minimize any
stresses from board warp or deflection.
possible mechanical
Items
Not recommended
Recommended
Place the product at a right
angle to the direction of the
anticipated mechanical
stress.
Deflection of board
1-2. The amount of mechanical stresses given will vary depending on capacitor layout. Please refer to diagram below.
1-3. When PCB is split, the amount of mechanical stress on the capacitors can vary according to the method used. The following methods
are listed in order from least stressful to most stressful: push-back, slit, V-grooving, and perforation. Thus, please consider the PCB,
split methods as well as chip location.
3. Mounting
Precautions
◆Adjustment of mounting machine
1. When capacitors are mounted on PCB, excessive impact load shall not be imposed on them.
2. Maintenance and inspection of mounting machines shall be conducted periodically.
◆Selection of Adhesives
1. When chips are attached on PCBs with adhesives prior to soldering, it may cause capacitor characteristics degradation unless the
following factors are appropriately checked : size of land patterns, type of adhesive, amount applied, hardening temperature and
hardening period. Therefore, please contact us for further information.
◆Adjustment of mounting machine
1. When the bottom dead center of a pick-up nozzle is too low, excessive force is imposed on capacitors and causes damages. To avoid
this, the following points shall be considerable.
Technical
（1）The bottom dead center of the pick-up nozzle shall be adjusted to the surface level of PCB without the board deflection.
（2）The pressure of nozzle shall be adjusted between 1 and 3 N static loads.
considerations
（3）To reduce the amount of deflection of the board caused by impact of the pick-up nozzle, supporting pins or back-up pins shall be
used on the other side of the PCB. The following diagrams show some typical examples of good and bad pick-up nozzle
placement:
▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .
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Items
Not recommended
Recommended
Single-sided mounting
Double-sided mounting
2. As the alignment pin is worn out, adjustment of the nozzle height can cause chipping or cracking of capacitors because of mechanical
impact on the capacitors.
To avoid this, the monitoring of the width between the alignment pins in the stopped position, maintenance, check and replacement of
the pin shall be conducted periodically.
◆Selection of Adhesives
Some adhesives may cause IR deterioration. The different shrinkage percentage of between the adhesive and the capacitors may result in
stresses on the capacitors and lead to cracking. Moreover, too little or too much adhesive applied to the board may adversely affect
components. Therefore, the following precautions shall be noted in the application of adhesives.
（1）Required adhesive characteristics
a. The adhesive shall be strong enough to hold parts on the board during the mounting & solder process.
b. The adhesive shall have sufficient strength at high temperatures.
c. The adhesive shall have good coating and thickness consistency.
d. The adhesive shall be used during its prescribed shelf life.
e. The adhesive shall harden rapidly.
f. The adhesive shall have corrosion resistance.
g. The adhesive shall have excellent insulation characteristics.
h. The adhesive shall have no emission of toxic gasses and no effect on the human body.
（2）The recommended amount of adhesives is as follows;
［Recommended condition］
Amount adhesive
After capacitors are bonded
Figure
212/316 case sizes as examples
a
b
c
0.3mm min
100 to 120μm
Adhesives shall not contact land
4. Soldering
◆Selection of Flux
Since flux may have a significant effect on the performance of capacitors, it is necessary to verify the following conditions prior to use;
（1）Flux used shall be less than or equal to 0.1 wt%（ in Cl equivalent） of halogenated content. Flux having a strong acidity content shall
not be applied.
（2）When shall capacitors are soldered on boards, the amount of flux applied shall be controlled at the optimum level.
（3）When water-soluble flux is used, special care shall be taken to properly clean the boards.
Precautions
◆Soldering
Temperature, time, amount of solder, etc. shall be set in accordance with their recommended conditions.
Sn-Zn solder paste can adversely affect MLCC reliability.
Please contact us prior to usage of Sn-Zn solder.
◆Selection of Flux
1-1. When too much halogenated substance（Chlorine, etc.） content is used to activate flux, or highly acidic flux is used, it may lead to
corrosion of terminal electrodes or degradation of insulation resistance on the surfaces of the capacitors.
1-2. Flux is used to increase solderability in wave soldering. However if too much flux is applied, a large amount of flux gas may be emitted
and may adversely affect the solderability. To minimize the amount of flux applied, it is recommended to use a flux-bubbling system.
1-3. Since the residue of water-soluble flux is easily dissolved in moisture in the air, the residues on the surfaces of capacitors in high
humidity conditions may cause a degradation of insulation resistance and reliability of the capacitors. Therefore, the cleaning
methods and the capability of the machines used shall also be considered carefully when water-soluble flux is used.
Technical
considerations
◆Soldering
･ Ceramic chip capacitors are susceptible to thermal shock when exposed to rapid or concentrated heating or rapid cooling.
･ Therefore, the soldering must be conducted with great care so as to prevent malfunction of the components due to excessive thermal
shock.
･ Preheating : Capacitors shall be preheated sufficiently, and the temperature difference between the capacitors and solder shall be within
100 to 130℃.
･ Cooling : The temperature difference between the capacitors and cleaning process shall not be greater than 100℃.
▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .
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［Reflow soldering］
【Recommended conditions for eutectic soldering】
【Recommended condition for Pb-free soldering】
Caution
①The ideal condition is to have solder mass（fillet）controlled to 1/2 to 1/3 of the
thickness of a capacitor.
②Because excessive dwell times can adversely affect solderability, soldering duration shall
be kept as close to recommended times as possible.
③Allowable number of reflow soldering : 2 times max.
［Wave soldering］
【Recommended conditions for eutectic soldering】
【Recommended condition for Pb-free soldering】
Caution
①Wave soldering must not be applied to capacitors designated as for reflow soldering only.
②Allowable number of wave soldering : 1 times max.
［Hand soldering］
【Recommended conditions for eutectic soldering】
【Recommended condition for Pb-free soldering】
⊿T
⊿T≦150℃
⊿T
316type or less
325type or more
⊿T≦130℃
Caution
①Use a 50W soldering iron with a maximum tip diameter of 1.0 mm.
②The soldering iron shall not directly touch capacitors.
③Allowable number of hand soldering : 1 times max.
5. Cleaning
Precautions
◆Cleaning conditions
1. When PCBs are cleaned after capacitors mounting, please select the appropriate cleaning solution in accordance with the intended use
of the cleaning. （e.g. to remove soldering flux or other materials from the production process.）
2. Cleaning condition shall be determined after it is verified by using actual cleaning machine that the cleaning process does not affect
capacitor's characteristics.
1. The use of inappropriate cleaning solutions can cause foreign substances such as flux residue to adhere to capacitors or deteriorate
their outer coating, resulting in a degradation of the capacitor's electrical properties （especially insulation resistance）.
2. Inappropriate cleaning conditions（ insufficient or excessive cleaning） may adversely affect the performance of
In the case of ultrasonic cleaning, too much power output can cause excessive vibration of PCBs which may lead
the capacitors.
to the
Technical
cracking of capacitors or the soldered portion, or decrease the terminal electrodes' strength. Therefore, the following conditions shall
be carefully checked;
considerations
Ultrasonic output :
Ultrasonic frequency :
20 W/ℓ or less
40 kHz or less
Ultrasonic washing period : 5 min. or less
▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .
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6. Resin coating and mold
1. With some type of resins, decomposition gas or chemical reaction vapor may remain inside the resin during the
while left under normal storage conditions resulting in the deterioration of the capacitor's performance.
hardening period or
Precautions
2. When a resin's hardening temperature is higher than capacitor's operating temperature, the stresses generated by the excessive heat
may lead to damage or destruction of capacitors.
The use of such resins, molding materials etc. is not recommended.
7. Handling
◆Splitting of PCB
1. When PCBs are split after components mounting, care shall be taken so as not to give any stresses of deflection or twisting to the board.
2. Board separation shall not be done manually, but by using the appropriate devices.
Precautions
◆Mechanical considerations
Be careful not to subject capacitors to excessive mechanical shocks.
（1）If ceramic capacitors are dropped onto a floor or a hard surface, they shall not be used.
（2）Please be careful that the mounted components do not come in contact with or bump against other boards or
components.
8. Storage conditions
◆Storage
1. To maintain the solderability of terminal electrodes and to keep packaging materials in good condition, care must be taken to control
temperature and humidity in the storage area. Humidity should especially be kept as low as possible.
・Recommended conditions
Ambient temperature : Below 30℃
Humidity
: Below 70% RH
Precautions
The ambient temperature must be kept below 40℃. Even under ideal storage conditions, solderability of capacitor is deteriorated as
time passes, so capacitors shall be used within 6 months from the time of delivery.
・Ceramic chip capacitors shall be kept where no chlorine or sulfur exists in the air.
2. The capacitance values of high dielectric constant capacitors will gradually decrease with the passage of time, so
care shall be
taken to design circuits . Even if capacitance value decreases as time passes, it will get back to the initial value by a heat treatment at
150℃ for 1hour.
If capacitors are stored in a high temperature and humidity environment, it might rapidly cause poor solderability due to terminal oxidation and
quality loss of taping/packaging materials. For this reason, capacitors shall be used within 6 months from the time of delivery. If exceeding the
above period, please check solderability before using the capacitors.
Technical
considerations
※RCR-2335B（Safety Application Guide for fixed ceramic capacitors for use in electronic equipment）is published by JEITA.
Please check the guide regarding precautions for deflection test, soldering by spot heat, and so on.
▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .
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相关型号：
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TAIYO YUDEN
HMK316B7224ML
Ceramic Capacitor, Multilayer, Ceramic, 100V, 20% +Tol, 20% -Tol, X7R, -/+15ppm/Cel TC, 0.22uF, 1206,
TAIYO YUDEN
HMK316B7224ML-T
Capacitor, Ceramic, Chip, General Purpose, 0.22uF, 100V, ±20%, X7R, 1206 (3216 mm), 0.063"T, -55º ~ +125ºC, 7" Reel/4mm pitch
TAIYO YUDEN
HMK316B7224ML8T
Medium-High Voltage MLCC for Telecommunications Infrastructure and Industrial Equipment / Medical Devices
TAIYO YUDEN
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